Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
PDF] Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
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Chip Bonding - an overview
Figure 2 from Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
PDF] Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding
Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
Fine‐Pitch Solder on Pad Process for Microbump Interconnection - Bae - 2013 - ETRI Journal - Wiley Online Library
PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
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PDF] Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies