Wafer level packaging and flip chip design are the most recent trends in LED manufacturing and packaging. These LED types are perfectly suited for producing COB modules. This combination already promises better thermal performance than standard SMD package based products. However, there is still room for improvements. Pao Chen, Director of Research and Development at Flip Chip Opto shows how a 3-pad flip chip LED further reduces thermal resistance, allows higher power and can help to reduce costs.
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12V voltage, directly connected to the battery. The COB surface emits light, the light is even and soft, and the effect is good! Low-pressure safety,
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