Numerical and experimental study on protective film removal towards the automation of flexible electronics assembly

Theoretical dependence of lap adhesive joint strength upon adhesive

Electrode tool (a) before and (b) after the machining and (c) 3D

Polymers, Free Full-Text

PDF] Shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics

Numerical and experimental study on protective film removal

Micromachines, Free Full-Text

Fabricated FPCB sample Download Scientific Diagram

Secure Clamping of Parts for Disassembly for Remanufacturing

The workcell developed for automating the coverlay application process.

Numerical and experimental study on protective film removal towards the automation of flexible electronics assembly