By A Mystery Man Writer
Flip-Chip Interconnections: Past, Present, and Future
Metals, Free Full-Text
PDF) UBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration
a) Under-bump metallization and micro-bumps fabricated on the VLSI
Mehdi ASGHARI KHIAVI, University of Toronto, Toronto
Scaling Bump Pitches In Advanced Packaging
US20030067073A1 - Under bump metallization pad and solder bump
a) Under-bump metallization and micro-bumps fabricated on the VLSI
Jon Lexau's research works Oracle Corporation, Redwood City and
Metals, Free Full-Text