UBM (under bump metallurgy) structure

Test Structures for (a) Direct Bump with metal interconnect only and

Large die, UBM free WLCSP: A closer look

Solder Balling for WLCSP and Flip Chip Interconnects

UBM (under bump metallurgy) structure

A study in flip-chip UBM/bump reliability with effects of SnPb solder composition - ScienceDirect

Electroless UBM Formation Service｜Special Site of JX Metals

Scaling Bump Pitches In Advanced Packaging

Schematic structures of the cross-section of the indium bump just

Figure 15 from The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition

UBM (Under Bump Metallization)

Figure 1 from Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization

Se-Young JANG, Vice Pesient, Ph.D, Samsung, Seoul