By A Mystery Man Writer
Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding
A. Peacock's research works European Space Agency, Paris (ESA) and other places
The outline of bump bond process steps. (1) deposition of field metal
Outline functional block diagram of the ESA ROIC front end-one pixel
PDF) GaAs array fabrication
The outline of bump bond process steps. (1) deposition of field metal
Hans ANDERSSON, Principal Research Engineer
PDF) GaAs array fabrication
PDF) GaAs array fabrication