Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds

Thermal conductivities of the three investigated EMC with different

Thermal Conductivity Archives

Bulk Thermal Conductivity vs. Thermal Impedence

Polymers, Free Full-Text

Polymers, Free Full-Text

Printable thermal interface gels solve automotive reliability challenge

Evolution of epoxy molding compounds and future carbon materials

Thermal Behavior of Thermoset Molding Compounds Used to Encapsulate IC Devices

Comparing Power Transistors Operating at HighTemperature Tj200C Knowing the Transistors in Designs - Technical Articles